Pdf _verified_: Ipc-7093a

: Techniques for evaluating solder joints that are hidden beneath the package, specifically the use of Automated X-ray Inspection (AXI) .

“Lead-free solder voids more than tin-lead.” Truth: The standard presents data that voiding mechanisms differ by alloy. SAC305 voids differently than low-silver alloys. The PDF includes alloy-specific recommendations. ipc-7093a pdf

As of 2026, IPC-7093A remains the active revision. However, working groups are already discussing , which will likely address: : Techniques for evaluating solder joints that are